Frost.com - Electronic Devices Research http://www.frost.com/c/10178/home.do http://www.frost.com/c/10178/home.do - Electronic Devices Research Frost & Sullivan Advancements in Wearables, Wireless Charging, and Rapid Computing http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-56-00-00 http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-56-00-00 This issue of Microelectronics TOE covers recent developments in wearables, wireless charging, and rapid computing. Innovations profiled include wearable to tackle stress and lack of concentration by Brainno, infinite charging for electric vehicles by the Stanford University, advanced security wearable through real-time imaging and voice alarm by Occly LLC, wireless charging through mousepad for PC gaming by Logitech, and a carbon-based transistor for ultra-fast computing by the University of Central Florida. The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory. Keywords: Wearables, stress management, wireless charging, electric vehicle charging, security wearables, carbon-based transistor, fast computing, graphene transistor Fri, 16 Jun 2017 00:00:00 +0100 Innovations in Near Field Communication Systems, Antenna Technology, and Underwater Positioning Systems http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-55-00-00 http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-55-00-00 This issue of Microelectronics TOE covers recent developments in near field communication (NFC) systems, antenna technology, and underwater positioning systems. Innovations profiled include NFC tags for anti-counterfeiting and direct marketing, beamforming antennas for 5G networks, NFC-based ring for the contactless payment market, a cost-effective spectrum management solution for space communication, and CDMA-based underwater positioning system. The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory. Keywords: NFC systems, underwater positioning systems, anti-counterfeiting, beamforming antennas, 5G networks, spectrum management solution, CDMA Fri, 9 Jun 2017 00:00:00 +0100 Innovations in Wearables, Imaging Systems, and Advanced Data Storage Systems http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-54-00-00 http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-54-00-00 This issue of Microelectronics TOE covers recent developments in wearables, imaging systems, and advanced data storage systems. Innovations profiled include wearables for detecting seizures by the Massachusetts Institute of Technology (MIT), using walking patterns to power and authenticate wearables by Commonwealth Scientific and Industrial Research Organization (CSIRO), a camera to see invisible objects by ICFO Institute of Photonic Sciences, data storage for unmanned aerial vehicles and unmanned underwater vehicles by Phoenix International Systems, and wearables to improve sports performance by TURINGSENSE. The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory. Keywords: imaging systems, CMOS, data storage, sports wearables Fri, 2 Jun 2017 00:00:00 +0100 Innovations in Automotive Sensors http://www.frost.com/prod/servlet/sublib/display-report.do?id=D79F-01-00-00-00 http://www.frost.com/prod/servlet/sublib/display-report.do?id=D79F-01-00-00-00 Sensor technology is enabling development of advanced systems for vehicle safety and control in the automotive sector. Automotive manufacturers are increasingly using electronics systems for improving vehicle performance, passenger safety and comfort. Integration of sensors and actuators into automotive control systems optimizes the performance of the vehicle by enhancing durability and reliability. Key sensing technologies covered in this technology and innovation report include LiDAR (Light Detection and Ranging), image-, touch-, touchless-, inertial-, pressure-, micro-electromechanical system (MEMS) accelerometer-, anisotropic magneto-resistive (AMR)-, giant magnetoresistance (GMR)-, and biometric-sensors and gyros. The innovation report discusses sensor-based innovations in automotive industry and captures the impact of current and future applications in vehicles. Key topics include: Technology and market dynamics PESTLE and SWOT analysis Industry value chain assessment Impact of megatrends Technology capabilities of various sensors Key sensor innovations and its impact IP and Funding scenario Growth opportunities and critical success factors Companies to Watch Key questions for strategy planning Mon, 29 May 2017 00:00:00 +0100 Innovations in High-temperature Electronics, Integrated Optics, and Underwater Communication Systems http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-53-00-00 http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-53-00-00 This issue of Microelectronics TOE covers recent developments in high-temperature electronics, integrated optics, and underwater communication systems. Innovations profiled include flexible OTFTS for high-temperature electronics by the Beihang University, contactless resonant inductive coupling-based probes for integrated circuits by the University of Windsor, frequency domain pilot multiplexing techniques of SC-FDE with less complexity by the South China University of Technology, an optics-based underwater wireless communication system by the Zhejiang University, and a heat dissipation system for integrated optics by Hitachi Ltd. The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory. Keywords: High-temperature electronics, underwater communication, integrated circuit, integrated optics Fri, 26 May 2017 00:00:00 +0100 Innovations in Transistors, Micro Displays, and Photodiodes http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-52-00-00 http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-52-00-00 This issue of Microelectronics TOE covers recent developments in transistors, micro displays, and photodiodes. Innovations profiled include ultra-fast bi-state laser transistors by the University of Illinois Urbana-Champaign, compact and highly secure OLED micro displays by Fraunhofer, robust diamond transistors for high power applications by the National Institute for Materials Sciences, transistors for performing complex operations similar to neurons by the Federal University of S o Carlos, and fast and efficient silicon photodiodes by the University of Oxford. The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory. Keywords: Silicon photodiodes, diamond transistors, micro displays, laser transistors Fri, 19 May 2017 00:00:00 +0100 Innovations in Antennas, Solid State Supercapacitors, and Li-Fi Communication http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-51-00-00 http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-51-00-00 This issue of Microelectronics TOE covers recent developments in antennas, solid state supercapacitors, and Li-Fi communication. Innovations profiled include microfabricated wideband low-profile antenna arrays for terahertz communication by the City University of Hong Kong, a thermophoresis-based solid state supercapacitor for wearables by the Texas A&M University, a wireless-enabled valve position indicator technology for nuclear power plants by Idaho National Laboratory, structurally integrated antennas for 5G communication systems by Xidian University, and a Li-Fi-based wireless system for automotive communication by the SRM university. The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory. Keywords: Antenna, supercapacitors, terahertz communication, 5G communication, Li-Fi Fri, 12 May 2017 00:00:00 +0100 Advancements in Transient Electronics http://www.frost.com/prod/servlet/sublib/display-report.do?id=D835-00-1B-00-00 http://www.frost.com/prod/servlet/sublib/display-report.do?id=D835-00-1B-00-00 This Future Tech TOE covers recent developments in transient electronics. The issue covers transient electronics technology snapshot and factors driving and hindering technology advancement. It also covers the application landscape and the technology patent and funding trends. The TOE also encompasses profiles of key innovators and offers key strategic insights. The Future Tech TechVision Opportunity Engine (TOE) captures emerging innovations in research and development, or profile existing technologies which have seen a resurgence in terms of new markets and applications. It usually provides a technology overview, drivers, challenges, research and development, analyst insights and key patent information. In some cases, technology convergence scenarios and future growth opportunities are outlined. It covers innovations and technologies in a variety of industry spaces including manufacturing, sensors, electronics, information and communications technologies, networks, lighting technologies, healthcare, medical devices, materials and coatings, and developments in the energy sector that contribute toward a sustainable and greener world. Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory. Keywords: Transient electronics, transient materials, dissolvable electronics Fri, 5 May 2017 00:00:00 +0100 Innovations in Transistors, Organic Semiconductors, and Hyperspectral Imaging http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-50-00-00 http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-50-00-00 This issue of Microelectronics TOE covers recent developments in transistors, organic semiconductors, and hyperspectral imaging. Innovations profiled include single-molecule silicon circuitry by the University of Barcelona (Spain) and the Curtin University (Australia), 3D Poly-Si thin film transistors by National Nano Device Laboratories, doping of an organic crystal by the National Institutes of Natural Sciences, virtual hyperspectral imaging for determining plant health by the Purdue University, and hyperspectral imaging systems by Corning Inc. The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory. Keywords: Thin-film transistor, TFT, hyperspectral imaging, organic crystal, silicon circuitry Fri, 5 May 2017 00:00:00 +0100 Innovations in Silicon Photonics, Free Space Optics, and Quantum Well Intermixing Technology http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-4F-00-00 http://www.frost.com/prod/servlet/sublib/display-report.do?id=D777-00-4F-00-00 This issue of Microelectronics TOE covers recent developments in silicon photonics, free space optics, and quantum well intermixing technology. Innovations profiled include a scalable ion exchange-based platform for fabrication of integrated optics by TEEM Photonics, a laser-based wireless communication system for free space optic communication by ViaLight Communication, a scalable photonic integration platform to enable 400G optical tranceivers by Colorchip, a wafer scale monolithic integration technique for silicon photonics by Skorpios Technologies Inc., and a multiple wavelength monolithic quantum well laser diode by Nanyang Technological University, The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory. Keywords: Silicon photonics, quantum well intermixing, free space optic communication Fri, 28 Apr 2017 00:00:00 +0100